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 Spec #CR #Revision #CR CatImpacted VersionTarget ReleaseTitleWG TDoc #CR status at WGWG meeting refWG Source informationTSG TDoc #CR status at TSGTSG meeting refTSG Source informationNew VersionWork ItemsRemarks
See details 23.43600141F18.1.0Rel-18Clarification and correction for edge load analytics Details S6-233822 agreedSA6#58Huawei, Hisilicon Details SP-231544 approvedSA#102SA WG618.2.0ADAES
See details 23.43600123F18.1.0Rel-18Clarification on parameter of the analytics request Details S6-234067 agreedSA6#58Huawei, Hisilicon Details SP-231544 approvedSA#102SA WG618.2.0ADAES
See details 23.4360011-F18.1.0Rel-18Updates to Procedure for supporting edge load analytics Details S6-233053 agreedSA6#57Ericsson Details SP-231544 approvedSA#102SA WG618.2.0ADAES
See details 23.4360010-F18.1.0Rel-18Updates to Slice usage pattern analytics Details S6-233052 agreedSA6#57Ericsson Details SP-231544 approvedSA#102SA WG618.2.0ADAES
See details 23.4360009-F18.1.0Rel-18Updates to Procedure for supporting service API analytics Details S6-233051 agreedSA6#57Ericsson Details SP-231544 approvedSA#102SA WG618.2.0ADAES
See details 23.4360008-F18.1.0Rel-18Updates to Procedure on support for location accuracy analytics Details S6-233050 agreedSA6#57Ericsson Details SP-231544 approvedSA#102SA WG618.2.0ADAES
See details 23.43600072F18.1.0Rel-18Updates to Procedure on support for UE-to-UE application performance analytics Details S6-233374 agreedSA6#57Ericsson Details SP-231544 approvedSA#102SA WG618.2.0ADAES
See details 23.4360006-F18.1.0Rel-18Updates to Procedure on support for slice-specific application performance analytics Details S6-233048 agreedSA6#57Ericsson Details SP-231544 approvedSA#102SA WG618.2.0ADAES
See details 23.43600051F18.1.0Rel-18Updates to Procedure on support for application performance analytics Details S6-233198 agreedSA6#57Ericsson Details SP-231544 approvedSA#102SA WG618.2.0ADAES
See details 23.43600044F18.1.0Rel-18Extend the edge performance analytics to support transmission quality analytics Details S6-234068 agreedSA6#58Huawei, Hisilicon Details SP-231544 approvedSA#102SA WG618.2.0ADAES