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| 38.101-3 | 1296 | 1 | F | 18.6.0 | Rel-18 | CR to TS 38.101-3 Rel-18 EN-DC Uplink Harmonic clean-up |
R4-2414386
| agreed | RAN4#112 | Skyworks Soluti... |
RP-242149
| approved | RAN#105 | RAN4 | 18.7.0 | DC_R18_1BLTE_1B... |
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| 38.101-3 | 1295 | - | F | 18.6.0 | Rel-18 | (NR_cov_enh2-Core) CR to 38.101-3 for powerr boosting feature supporting CA |
R4-2412990
| agreed | RAN4#112 | Ericsson, Qualc... |
RP-242159
| approved | RAN#105 | RAN4 | 18.7.0 | NR_cov_enh2-Core |
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| 38.101-3 | 1294 | 2 | F | 18.6.0 | Rel-18 | CR for EN-DC Harmonic Mixing clean-up PC2 |
R4-2414438
| agreed | RAN4#112 | Qualcomm France... |
RP-242150
| approved | RAN#105 | RAN4 | 18.7.0 | HPUE_FR1_DC_LTE... |
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| 38.101-3 | 1293 | 2 | F | 18.6.0 | Rel-18 | CR for EN-DC Harmonic Mixing clean-up PC3 |
R4-2414437
| agreed | RAN4#112 | Qualcomm France... |
RP-242149
| approved | RAN#105 | RAN4 | 18.7.0 | DC_R18_1BLTE_1B... |
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| 38.101-3 | 1292 | 2 | B | 18.6.0 | Rel-18 | R18 Cat-F CR 38.101-3 channel spacing for intra-band EN-DC[Intra-Band_EN-DC_Channelspacing] |
R4-2414423
| agreed | RAN4#112 | Huawei, HiSilicon |
RP-242194
| approved | RAN#105 | RAN4 | 18.7.0 | TEI18 |
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| 38.101-3 | 1290 | 1 | F | 18.6.0 | Rel-18 | (4Rx_low_NR_band_handheld_3Tx_NR_CA_ENDC) Correction on configured output power of 3Tx EN-DC including UL MIMO and Tx diversity |
R4-2414410
| agreed | RAN4#112 | CHTTL |
RP-242149
| approved | RAN#105 | RAN4 | 18.7.0 | 4Rx_low_NR_band... |
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| 38.101-3 | 1285 | - | F | 18.6.0 | Rel-18 | CR 38.101-3 correcting 4 bands NR CA configuration tables |
R4-2412380
| agreed | RAN4#112 | Ericsson |
RP-242158
| approved | RAN#105 | RAN4 | 18.7.0 | NR_CADC_R18_yBD... |
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| 38.101-3 | 1284 | - | F | 18.6.0 | Rel-18 | CR 38.101-3 correcting 3 bands NR CA configuration tables |
R4-2412378
| agreed | RAN4#112 | Ericsson |
RP-242158
| approved | RAN#105 | RAN4 | 18.7.0 | NR_CADC_R18_3BD... |
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| 38.101-3 | 1283 | - | F | 18.6.0 | Rel-18 | CR 38.101-3 correcting 2 bands NR CA configuration tables |
R4-2412376
| agreed | RAN4#112 | Ericsson |
RP-242158
| approved | RAN#105 | RAN4 | 18.7.0 | NR_CADC_R18_2BD... |
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| 38.101-3 | 1282 | 1 | F | 18.6.0 | Rel-18 | (DC_R18_2BLTE_1BNR_3DL2UL) CR to TS 38.101-3 Rel18 Removal of Unnecessary NE-DC Requirements |
R4-2414426
| agreed | RAN4#112 | Huawei, HiSilicon |
RP-242149
| approved | RAN#105 | RAN4 | 18.7.0 | DC_R18_2BLTE_1B... |
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| 38.101-3 | 1276 | 1 | F | 18.6.0 | Rel-18 | CR 38.101-3 Clarifications for non-co-located requirements |
R4-2414455
| agreed | RAN4#112 | Nokia, Samsung,... |
RP-242155
| approved | RAN#105 | RAN4 | 18.7.0 | NonCol_intraB_E... |
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| 38.101-3 | 1271 | 1 | F | 18.6.0 | Rel-18 | (DC_R18_2BLTE_1BNR_3DL2UL-Core) Rel-18 Cat F CR for TS 38.101-3 to add PC3 MSD |
R4-2414398
| agreed | RAN4#112 | Samsung, KDDI C... |
RP-242149
| approved | RAN#105 | RAN4 | 18.7.0 | DC_R18_2BLTE_1B... |
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| 38.101-3 | 1266 | - | A | 18.6.0 | Rel-18 | (ENDC_UE_PC2_R17_NR_TDD-Core) CR for 38.101-3 to add general text descriptions on higher power class(es) applicability for higher order band combinations |
R4-2411165
| agreed | RAN4#112 | Apple |
RP-242150
| approved | RAN#105 | RAN4 | 18.7.0 | ENDC_UE_PC2_R17... |
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| 38.101-3 | 1264 | - | A | 18.6.0 | Rel-18 | (DC_R17_2BLTE_1BNR_3DL2UL-Core, DC_R17_xBLTE_2BNR_yDL2UL) CR to introduce missing MSD requirements |
R4-2411161
| agreed | RAN4#112 | Apple |
RP-242149
| approved | RAN#105 | RAN4 | 18.7.0 | DC_R17_2BLTE_1B... |
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