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 Spec #CR #Revision #CR CatImpacted VersionTarget ReleaseTitleWG TDoc #CR status at WGWG meeting refWG Source informationTSG TDoc #CR status at TSGTSG meeting refTSG Source informationNew VersionWork ItemsRemarks
See details 38.8630004-F17.1.0Rel-17CR for TR 38.863 to maintain SAN parts Details R4-2219608 postponedRAN4#105Huawei, HiSilicon    NR_NTN_solution...
See details 38.86300031F17.1.0Rel-17CR for TR 38.863 to maintain SAN parts Details R4-2217315 postponedRAN4#104-bis-eHuawei, HiSilicon    NR_NTN_solution...
See details 38.8630003-F17.1.0Rel-17CR for TR 38.863 to maintain SAN parts Details R4-2216064 revisedRAN4#104-bis-eHuawei, HiSilicon    NR_NTN_solution...
See details 38.86300021F17.0.0Rel-17Correction to TR 38.863 on Regulatory aspects for HAPS Details R4-2214540 agreedRAN4#104-eNokia, SoftBank Details RP-222035 approvedRAN#97-eRAN417.1.0NR_NTN_solution...
See details 38.8630002-F17.0.0Rel-17Correction to TR 38.863 on Regulatory aspects for HAPS Details R4-2213207 revisedRAN4#104-eNokia, SoftBank    NR_NTN_solution...
See details 38.8630001-F17.0.0Rel-17CR for 38.863 to maintain UE RF parts Details R4-2213155 agreedRAN4#104-eHuawei, HiSilicon Details RP-222035 approvedRAN#97-eRAN417.1.0NR_NTN_solution...