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 Spec #CR #Revision #CR CatImpacted VersionTarget ReleaseTitleWG TDoc #CR status at WGWG meeting refWG Source informationTSG TDoc #CR status at TSGTSG meeting refTSG Source informationNew VersionWork ItemsRemarks
See details 25.3060284-B10.0.0Rel-10Introduction of MC-HSUPA categories Details R2-106744  RAN2#72TD Tech Details RP-101365 approvedRAN#50R210.1.0TDD_MC_HSUPA
See details 25.3060283-F10.0.0Rel-10Additional of ôSupported Carrier Combinationö for dual band operation Details R2-106750  RAN2#72Huawei, HiSilicon Details RP-101366 approvedRAN#50R210.1.04C_HSDPA-Core
See details 25.30602821A10.0.0Rel-10Introduction of REL-9 access stratum release indicator Details R2-106734 agreedRAN2#72ZTE Details RP-101212 approvedRAN#50R210.1.0TEI9
See details 25.30602801F10.0.0Rel-10Introduction of REL-10 access stratum release indicator Details R2-106755 agreedRAN2#72ZTE Details RP-101213 approvedRAN#50R210.1.0TEI10
See details 25.3060279-A10.0.0Rel-10Correction for value range of total RLC AM, MAC-hs and MAC-ehs buffer size Details R2-106070 agreedRAN2#72Nokia Corporati... Details RP-101211 approvedRAN#50R210.1.0RANimp-DC_MIMO
See details 25.30602781F10.0.0Rel-10Correction for value range of total RLC AM, MAC-hs and MAC-ehs buffer size Details R2-106981  RAN2#72Nokia Corporati... Details RP-101366 approvedRAN#50R210.1.04C_HSDPA-Core