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 Spec #CR #Revision #CR CatImpacted VersionTarget ReleaseTitleWG TDoc #CR status at WGWG meeting refWG Source informationTSG TDoc #CR status at TSGTSG meeting refTSG Source informationNew VersionWork ItemsRemarks
See details 36.2131088-F13.9.0Rel-13Correction on PUCCH configuration with CEModeA or CEModeB Details R1-1807441 agreedRAN1#93Huawei, HiSilicon Details RP-181164 approvedRAN#80RAN113.10.0LTE_MTCe2_L1-Core
See details 36.2131085-F13.9.0Rel-13Clarification on PUCCH formats Details R1-1807438 agreedRAN1#93Qualcomm Incorp... Details RP-181162 approvedRAN#80RAN113.10.0LTE_CA_enh_b5C-Core
See details 36.2131082-F13.9.0Rel-13Clarification on simultaneousAckNackAndCQI for format 4-5 and format 3 Details R1-1807435 agreedRAN1#93Qualcomm Incorp... Details RP-181162 approvedRAN#80RAN113.10.0LTE_CA_enh_b5C-Core
See details 36.2131079-F13.9.0Rel-13Clarification on beta offset for more than 22 HARQ-Ack bits Details R1-1807432 agreedRAN1#93Qualcomm Incorp... Details RP-181162 approvedRAN#80RAN113.10.0LTE_CA_enh_b5C-Core
See details 36.2131076-F13.9.0Rel-13Correction of a typo further to CR0594 faulty implementation Details R1-1807423 agreedRAN1#93ETSI (MCC) Details RP-181162 approvedRAN#80RAN113.10.0LTE_CA_enh_b5C-Core
See details 36.2131058-F13.9.0Rel-13Correction on number of subframes for semistatic codebook determination and transmission over PUSCH Details R1-1805301 agreedRAN1#92-BisQualcomm Incorp... Details RP-181162 approvedRAN#80RAN113.10.0LTE_CA_enh_b5C-Core