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 Spec #CR #Revision #CR CatImpacted VersionTarget ReleaseTitleWG TDoc #CR status at WGWG meeting refWG Source informationTSG TDoc #CR status at TSGTSG meeting refTSG Source informationNew VersionWork ItemsRemarks
See details 23.2220057-B16.2.0Rel-16Updates to CAPIF events procedures for 3rd party trust domain Details S6-190385 agreedSA6#29Samsung Electronics Details SP-190072 approvedSA#83SA WG616.3.0eCAPIF
See details 23.22200561B16.2.0Rel-16Updates to AMF procedures for 3rd party trust domain Details S6-190427 agreedSA6#29Samsung Electronics Details SP-190072 approvedSA#83SA WG616.3.0eCAPIF
See details 23.22200551B16.2.0Rel-16Updates to APF procedures for 3rd party trust domain Details S6-190426 agreedSA6#29Samsung Electronics Details SP-190072 approvedSA#83SA WG616.3.0eCAPIF
See details 23.22200541B16.2.0Rel-16Updates to AEF procedures for 3rd party trust domain Details S6-190425 agreedSA6#29Samsung Electronics Details SP-190072 approvedSA#83SA WG616.3.0eCAPIF
See details 23.22200532B16.2.0Rel-16Procedures for registration of API provider domain functions Details S6-190494 agreedSA6#29Samsung Electronics Details SP-190072 approvedSA#83SA WG616.3.0eCAPIF
See details 23.22200521B16.2.0Rel-16Architectural requirements for registration of API provider domain functions Details S6-190423 agreedSA6#29Samsung Electronics Details SP-190072 approvedSA#83SA WG616.3.0eCAPIF
See details 23.22200512B16.2.0Rel-16Service API discover for CAPIF interconnection Details S6-190496 agreedSA6#29Huawei, Hisilicon Details SP-190072 approvedSA#83SA WG616.3.0eCAPIF
See details 23.22200502B16.2.0Rel-16Multiple CCFs deployment in a PLMN trust domain Details S6-190495 agreedSA6#29Huawei, Hisilicon Details SP-190072 approvedSA#83SA WG616.3.0eCAPIF
See details 23.22200491B16.2.0Rel-16Service API discovery involving multiple CCFs Details S6-190428 agreedSA6#29Huawei, Hisilicon Details SP-190072 approvedSA#83SA WG616.3.0eCAPIF
See details 23.22200481C16.2.0Rel-16Interactions between API exposing functions Details S6-190177 agreedSA6#28Huawei, Hisilicon Details SP-190072 approvedSA#83SA WG616.3.0eCAPIF
See details 23.22200462B16.2.0Rel-16API invocation request routing with topology hiding Details S6-190277 agreedSA6#28Huawei, Hisilicon Details SP-190072 approvedSA#83SA WG616.3.0eCAPIF
See details 23.22200452B16.2.0Rel-16API sharing for CCF interconnection Details S6-190261 agreedSA6#28Huawei, Hisilicon Details SP-190072 approvedSA#83SA WG616.3.0eCAPIF
See details 23.22200442F16.2.0Rel-16Update procedures with topology hidding Details S6-190260 agreedSA6#28Huawei, Hisilicon Details SP-190072 approvedSA#83SA WG616.3.0eCAPIF