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 Spec #CR #Revision #CR CatImpacted VersionTarget ReleaseTitleWG TDoc #CR status at WGWG meeting refWG Source informationTSG TDoc #CR status at TSGTSG meeting refTSG Source informationNew VersionWork ItemsRemarks
See details 38.32200361F16.0.0Rel-16Correction on RLC spec to support the BAP as upper layer Details R2-2006151 agreedRAN2#110-eHuawei, HiSilicon Details RP-201179 approvedRAN#88-eRAN216.1.0NR_IAB-Core