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 Spec #CR #Revision #CR CatImpacted VersionTarget ReleaseTitleWG TDoc #CR status at WGWG meeting refWG Source informationTSG TDoc #CR status at TSGTSG meeting refTSG Source informationNew VersionWork ItemsRemarks
See details 25.1011088-B13.0.0Rel-1325.101 CR to introduce DB-DC-HSUPA in Rel-13 Details R4-157243 revisedRAN4#77QUALCOMM UK Ltd    HSUPA_DB_MC-Core
See details 25.1011081-B13.0.0Rel-13Introduction of DB-DC-HSUPA for TS25.101 (Tx part) Details R4-155968 notedRAN4#76-BISEricsson    HSUPA_DB_MC-Core
See details 25.10407121B13.0.0Rel-13Introduction of DB-DC-HSUPA for TS25.104 Details R4-156707 agreedRAN4#76-BISEricsson, Qualcomm Details RP-152141 approvedRAN#70RAN413.1.0HSUPA_DB_MC-Core
See details 25.1040712-B13.0.0Rel-13Introduction of DB-DC-HSUPA for TS25.104 Details R4-155969 revisedRAN4#76-BISEricsson    HSUPA_DB_MC-Core
See details 25.1040709-B12.5.0Rel-13Introduction of DB-DC-HSUPA Details R4-154420 notedRAN4#76    HSUPA_DB_MC-Core
See details 25.1331414-B12.8.0Rel-1325.133 CR to introduce DB-DC-HSUPA in Rel-13 Details R4-157244 revisedRAN4#77QUALCOMM UK Ltd    HSUPA_DB_MC-Core
See details 25.14107351B13.0.0Rel-13Introduction of DB-DC-HSUPA for TS25.141 Details R4-156708 agreedRAN4#76-BISEricsson Details RP-152141 approvedRAN#70RAN413.1.0HSUPA_DB_MC-Core
See details 25.1410735-B13.0.0Rel-13Introduction of DB-DC-HSUPA for TS25.141 Details R4-155970 revisedRAN4#76-BISEricsson    HSUPA_DB_MC-Core
See details 25.21301211B12.0.0Rel-13Introduction of HSPA Dual-Band UL carrier aggregation Details R1-157587 agreedRAN1#83Qualcomm Details RP-152030 approvedRAN#70RAN113.0.0HSUPA_DB_MC-Core
See details 25.2130121-B12.0.0Rel-13Introduction of HSPA Dual-Band UL carrier aggregation Details R1-156995 notedRAN1#83Qualcomm Europe...    HSUPA_DB_MC-Core
See details 25.2130120-B Rel-13Introduction of HSPA Dual-Band UL carrier aggregation Details R1-156151 agreedRAN1#82-BISQualcomm Incorp...    HSUPA_DB_MC-Core
See details 25.3060511-A14.0.0Rel-14Correction on dual band dual cell E-DCH capability Details R2-167471 agreedRAN2#96Huawei, HiSilicon Details RP-162319 approvedRAN#74RAN214.1.0HSUPA_DB_MC-Core
See details 25.3060510-F13.1.0Rel-13Correction on dual band dual cell E-DCH capability Details R2-167470 agreedRAN2#96Huawei, HiSilicon Details RP-162319 approvedRAN#74RAN213.2.0HSUPA_DB_MC-Core
See details 25.30605061A12.7.0Rel-12Introduction of DB-DC-HSUPA in earlier release Details R2-164302 agreedRAN2#94Qualcomm Incorp... Details RP-161083 approvedRAN#72RAN212.8.0HSUPA_DB_MC-Cor...
See details 25.30605051B11.10.0Rel-11Introduction of DB-DC-HSUPA in earlier release Details R2-164301 agreedRAN2#94Qualcomm Incorp... Details RP-161083 approvedRAN#72RAN211.11.0HSUPA_DB_MC-Cor...
See details 25.30604961B12.6.0Rel-13Introduction of DB-DC-HSUPA Details R2-157074 agreedRAN2#92Qualcomm Inc, H... Details RP-152058 approvedRAN#70RAN213.0.0HSUPA_DB_MC-Core
See details 25.3060496-B12.6.0Rel-13Introduction of DB-DC-HSUPA Details R2-156949 revisedRAN2#92Qualcomm Inc    HSUPA_DB_MC-Core
See details 25.31901382B12.3.0Rel-13Introduction of DB-DC-HSUPA to 25.319 Details R2-157075 agreedRAN2#92Qualcomm Inc, H... Details RP-152058 approvedRAN#70RAN213.0.0HSUPA_DB_MC-Core
See details 25.31901381B12.3.0Rel-13Introduction of DB-DC-HSUPA to 25.319 Details R2-156950 revisedRAN2#92Qualcomm    HSUPA_DB_MC-Core
See details 25.3190138-B12.3.0Rel-13Introduction of DB-DC-HSUPA to 25.319 Details R2-157006 revisedRAN2#92Qualcomm    HSUPA_DB_MC-Core
See details 25.33158582A12.9.0Rel-12Introduction of DB-DC-HSUPA in earlier release Details R2-164341 agreedRAN2#94Qualcomm Incorp... Details RP-161083 approvedRAN#72RAN212.10.0HSUPA_DB_MC-Cor...
See details 25.33158582A12.9.0Rel-12Introduction of DB-DC-HSUPA in earlier release Details R2-164341 agreedRAN2#94Qualcomm Incorp... Details RP-161080 withdrawnRAN#72RAN212.10.0HSUPA_DB_MC-Cor...
See details 25.33158581A12.9.0Rel-12Introduction of DB-DC-HSUPA in earlier release Details R2-164304 revisedRAN2#94Qualcomm Incorp...    HSUPA_DB_MC-Cor...
See details 25.33158572B11.16.0Rel-11Introduction of DB-DC-HSUPA in earlier release Details R2-164340 agreedRAN2#94Qualcomm Incorp... Details RP-161083 approvedRAN#72RAN211.17.0HSUPA_DB_MC-Cor...
See details 25.33158571B11.16.0Rel-11Introduction of DB-DC-HSUPA in earlier release Details R2-164303 revisedRAN2#94Qualcomm Incorp...    HSUPA_DB_MC-Cor...
See details 25.33158203B13.0.0Rel-13Introduction of DB-DC-HSUPA Details R2-157073 agreedRAN2#92Qualcomm Inc, H... Details RP-152058 approvedRAN#70RAN213.1.0HSUPA_DB_MC-Core
See details 25.33158202B13.0.0Rel-13Introduction of DB-DC-HSUPA Details R2-156948 revisedRAN2#92Qualcomm Inc    HSUPA_DB_MC-Core
See details 25.33158201B13.0.0Rel-13Introduction of DB-DC-HSUPA Details R2-156947 revisedRAN2#92Qualcomm Inc    HSUPA_DB_MC-Core