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 Spec #CR #Revision #CR CatImpacted VersionTarget ReleaseTitleWG TDoc #CR status at WGWG meeting refWG Source informationTSG TDoc #CR status at TSGTSG meeting refTSG Source informationNew VersionWork ItemsRemarks
See details 23.2800165-A16.0.0Rel-16Separate affiliation status from Group document Details S6-181409 revisedSA6#26Huawei, Hisilicon    MCImp-MC_ARCH
See details 23.2800164-A15.4.0Rel-15Separate affiliation status from Group document Details S6-181408 postponedSA6#26Huawei, Hisilicon    MCImp-MC_ARCH
See details 23.2800163-F14.6.0Rel-14Separate affiliation status from Group document Details S6-181407 postponedSA6#26Huawei, Hisilicon    MCImp-MC_ARCH
See details 23.2800157-A15.4.0Rel-15Corrections to group affiliation procedures Details S6-181370 postponedSA6#26TD Tech, CHENGD...    MCImp-MC_ARCH
See details 23.2800156-F14.6.0Rel-14Corrections to group affiliation procedures Details S6-181369 postponedSA6#26TD Tech, CHENGD...    MCImp-MC_ARCH
See details 23.2800148-F15.3.0Rel-16Making group regroup work by including group configuration Details S6-180757 postponedSA6#24Sepura PLC, Hyt...    MCImp-MC_ARCH, TEI16
See details 23.2800147-F15.3.0Rel-16Making group regroup work by including temporary group ID Details S6-180756 postponedSA6#24Sepura PLC, Hyt...    MCImp-MC_ARCH, TEI16
See details 23.28001452A15.3.0Rel-15Clarification on MBMS bearer announcement Details S6-180730 agreedSA6#23TD Tech Details SP-180364 approvedSA#80SA WG615.4.0MCImp-MC_ARCH
See details 23.28001451A15.3.0Rel-15Clarification on MBMS bearer announcement Details S6-180670 revisedSA6#23TD Tech    MCImp-MC_ARCH
See details 23.2800145-A15.3.0Rel-15Clarification on MBMS bearer announcement Details S6-180588 revisedSA6#23TD Tech    MCImp-MC_ARCH
See details 23.28001442F14.5.0Rel-14Clarification on MBMS bearer announcement Details S6-180729 agreedSA6#23TD Tech Details SP-180364 approvedSA#80SA WG614.6.0MCImp-MC_ARCH
See details 23.28001441F14.5.0Rel-14Clarification on MBMS bearer announcement Details S6-180669 revisedSA6#23TD Tech    MCImp-MC_ARCH
See details 23.2800144-F14.5.0Rel-14Clarification on MBMS bearer announcement Details S6-180587 revisedSA6#23TD Tech    MCImp-MC_ARCH
See details 23.2800137-D15.2.0Rel-15Update of references to stage 1 specifications Details S6-180260 revisedSA6#22The Police of t...    MCImp-MC_ARCH
See details 23.28001351A15.2.0Rel-15Aligning 10.9.3.1 procedure with diagram Details S6-180434 agreedSA6#22AT&T GNS Belgiu... Details SP-180145 approvedSA#79SA WG615.3.0MCImp-MC_ARCH
See details 23.2800135-F15.2.0Rel-15Correction to 10.9.3.1 procedure Details S6-180252 revisedSA6#22AT&T GNS Belgiu...    MCImp-MC_ARCH
See details 23.28001341F14.4.0Rel-14Aligning 10.9.3.1 procedure with diagram Details S6-180433 agreedSA6#22AT&T GNS Belgiu... Details SP-180145 approvedSA#79SA WG614.5.0MCImp-MC_ARCH
See details 23.2800134-F14.4.0Rel-14Correction to 10.9.3.1 procedure Details S6-180251 revisedSA6#22AT&T GNS Belgiu...    MCImp-MC_ARCH
See details 23.28001291A15.2.0Rel-15Correction of security specification references Details S6-180123 agreedSA6#21Motorola Solutions Details SP-180145 approvedSA#79SA WG615.3.0MCImp-MC_ARCH
See details 23.2800129-A15.2.0Rel-15Correction of security specification references Details S6-180068 revisedSA6#21Motorola Solutions    MCImp-MC_ARCH
See details 23.28001281F14.4.0Rel-14Correction of security specification references Details S6-180122 agreedSA6#21Motorola Solutions Details SP-180145 approvedSA#79SA WG614.5.0MCImp-MC_ARCH
See details 23.2800128-F14.4.0Rel-14Correction of security specification references Details S6-180067 revisedSA6#21Motorola Solutions    MCImp-MC_ARCH
See details 23.28001201A15.1.0Rel-15Add group deletion functionality Details S6-171771 agreedSA6#20Motorola Soluti... Details SP-170887 approvedSA#78SA WG615.2.0MCImp-MC_ARCH
See details 23.2800120-A15.1.0Rel-15Add group deletion functionality Details S6-171668 revisedSA6#20Motorola Soluti...    MCImp-MC_ARCH
See details 23.28001191F14.3.0Rel-14Add group deletion functionality Details S6-171770 agreedSA6#20Motorola Soluti... Details SP-170887 approvedSA#78SA WG614.4.0MCImp-MC_ARCH
See details 23.2800119-F14.3.0Rel-14Add group deletion functionality Details S6-171667 revisedSA6#20Motorola Soluti...    MCImp-MC_ARCH
See details 23.28001161F14.3.0Rel-14Clarification for simultaneous session Details S6-171773 withdrawnSA6#20TD Tech    MCImp-MC_ARCH
See details 23.2800116-F14.3.0Rel-14Clarification for simultaneous session Details S6-171661 revisedSA6#20TD Tech    MCImp-MC_ARCH
See details 23.28001042F15.1.0Rel-15PSI configuration for GMS Details S6-171826 postponedSA6#20ZTE Trunking, T...    MCImp-MC_ARCH
See details 23.28001041F15.1.0Rel-15PSI configuration for GMS Details S6-171772 revisedSA6#20ZTE Trunking, T...    MCImp-MC_ARCH
See details 23.2800104-F15.1.0Rel-15PSI configuration for GMS Details S6-171588 revisedSA6#20ZTE trunking    MCImp-MC_ARCH
See details 23.2800103-F14.3.0Rel-14PSI configuration for GMS Details S6-171587 postponedSA6#20ZTE trunking    MCImp-MC_ARCH
See details 23.2800102-F15.1.0Rel-15PSI configuration for CMS Details S6-171586 not pursuedSA6#20ZTE trunking    MCImp-MC_ARCH
See details 23.2800101-F14.3.0Rel-14PSI configuration for CMS Details S6-171585 not pursuedSA6#20ZTE trunking    MCImp-MC_ARCH
See details 23.2800096-D15.1.0Rel-15CR to replace uneditable figures Details S6-171401 agreedSA6#19CMCC, Huawei, H... Details SP-170887 approvedSA#78SA WG615.2.0MCImp-MC_ARCH
See details 23.2800088-F15.1.0Rel-15CR on 23280 clarification MBMS usage Details S6-171198 revisedSA6#19TD Tech Ltd    MCImp-MC_ARCH
See details 23.2800087-F14.3.0Rel-14CR on 23280 clarification MBMS usage Details S6-171197 not pursuedSA6#19TD Tech Ltd    MCImp-MC_ARCH
See details 23.28000862F15.1.0Rel-15CR on 23280 clarification MC service group ID Details S6-171459 revisedSA6#19TD Tech Ltd    TEI15, MCImp-MC_ARCH
See details 23.28000861F15.1.0Rel-15CR on 23280 clarification MC service group ID Details S6-171403 revisedSA6#19TD Tech Ltd    MCImp-MC_ARCH
See details 23.2800086-F15.1.0Rel-15CR on 23280 clarification MC service group ID Details S6-171194 revisedSA6#19TD Tech Ltd    MCImp-MC_ARCH
See details 23.28000851F14.3.0Rel-14CR on clarification for MC service group ID Details S6-171402 not pursuedSA6#19TD Tech Ltd    MCImp-MC_ARCH
See details 23.2800085-F14.3.0Rel-14CR 23280 clarification MC service group ID Details S6-171193 revisedSA6#19TD Tech Ltd    MCImp-MC_ARCH
See details 23.28000831D14.3.0Rel-14CR to replace uneditable figures Details S6-171400 agreedSA6#19CMCC, Huawei, H... Details SP-170887 approvedSA#78SA WG614.4.0MCImp-MC_ARCH
See details 23.2800083-D14.3.0Rel-14CR to replace uneditable figures Details S6-171164 revisedSA6#19CMCC, Huawei, H...    MCImp-MC_ARCH
See details 23.28000702A15.1.0Rel-15MC group configuration data correction Details S6-171308 agreedSA6#19MCC Details SP-170897 approvedSA#78SA WG615.2.0MCImp-MC_ARCH, TEI15
See details 23.28000701A15.0.0Rel-15MC group configuration data correction Details S6-170957 revisedSA6#18Ericsson LM Details SP-170679 approvedSA#77SA WG615.1.0MCImp-MC_ARCH 2G
See details 23.2800070-F15.0.0Rel-15MC group configuration data correction Details S6-170845 revisedSA6#18Ericsson LM    MCImp-MC_ARCH
See details 23.28000691F14.2.0Rel-14MC group configuration data correction Details S6-170956 agreedSA6#18Ericsson LM Details SP-170679 approvedSA#77SA WG614.3.0MCImp-MC_ARCH
See details 23.2800069-F14.2.0Rel-14MC group configuration data correction Details S6-170844 revisedSA6#18Ericsson LM    MCImp-MC_ARCH
See details 23.28000631F14.1.0Rel-14Corrections to Group configuration data for all MC services Details S6-170729 agreedSA6#17BlackBerry Details SP-170390 approvedSA#76SA WG614.2.0MCImp-MC_ARCH
See details 23.2800063-F14.1.0Rel-14Corrections to Group configuration data for all MC services Details S6-170639 revisedSA6#17BlackBerry    MCImp-MC_ARCH
See details 23.28000552F14.1.0Rel-14Inclusion of KMSUri to allow multiple security domains Details S6-170728 agreedSA6#17Motorola Solutions Details SP-170390 approvedSA#76SA WG614.2.0MCImp-MC_ARCH
See details 23.28000551F14.1.0Rel-14Inclusion of KMSUri to allow multiple security domains Details S6-170643 revisedSA6#17Motorola Solutions    MCImp-MC_ARCH
See details 23.2800055-F14.1.0Rel-14Inclusion of KMSUri to allow multiple security domains Details S6-170557 revisedSA6#17Motorola Solutions    MCImp-MC_ARCH
See details 23.28000541F14.1.0Rel-14Alignment of server address with stage 3 Details S6-170648 agreedSA6#17Motorola Soluti... Details SP-170390 approvedSA#76SA WG614.2.0MCImp-MC_ARCH
See details 23.2800054-F14.1.0Rel-14Alignment of server address with stage 3 Details S6-170553 revisedSA6#17Motorola Soluti...    MCImp-MC_ARCH
See details 23.2800050-F14.1.0Rel-14Correction of information flow MBMS listening report Details S6-170544 agreedSA6#17Ericsson Details SP-170390 approvedSA#76SA WG614.2.0MCImp-MC_ARCH
See details 23.2800049-C14.1.0Rel-14Resource Management for MCData Details S6-170543 withdrawnSA6#17Ericsson LM    MCImp-MC_ARCH, ...
See details 23.2800048-C14.1.0Rel-14Resource Management for MCVideo Details S6-170542 withdrawnSA6#17Ericsson LM    MCImp-MC_ARCH, ...
See details 23.2800047-C14.1.0Rel-14Resource Management for MCPTT Details S6-170541 withdrawnSA6#17Ericsson LM    MCImp-MC_ARCH, ...
See details 23.2800046-C14.1.0Rel-14Resource Management in CFA Details S6-170540 withdrawnSA6#17Ericsson LM    MCImp-MC_ARCH
See details 23.2800045-F14.1.0Rel-14Clarification of off network affiliation Details S6-170416 postponedSA6#16The Police of N...    MCImp-MC_ARCH
See details 23.28000441F14.1.0Rel-14Add Note to bearer coordination procedure Details S6-170476 agreedSA6#16Motorola Solutions Details SP-170390 approvedSA#76SA WG614.2.0MCImp-MC_ARCH
See details 23.2800044-F14.1.0Rel-14Add Note to bearer coordination procedure Details S6-170375 revisedSA6#16Motorola Solutions    MCImp-MC_ARCH
See details 23.2800041-C14.1.0Rel-14Multiple MBMS servers EN removal Details S6-170314 not pursuedSA6#16Huawei, Hisilicon    MCImp-MC_ARCH
See details 23.28000352F14.1.0Rel-14Corrections on determination of MBMS bearer quality Details S6-170429 agreedSA6#16TD Tech Details SP-170390 approvedSA#76SA WG614.2.0MCImp-MC_ARCH
See details 23.28000351F14.1.0Rel-14Corrections on determination of MBMS bearer quality Details S6-170373 revisedSA6#16TD Tech    MCImp-MC_ARCH
See details 23.2800035-F14.1.0Rel-14Corrections on determination of MBMS bearer quality Details S6-170272 revisedSA6#16TD Tech    MCImp-MC_ARCH
See details 23.2800034-F14.1.0Rel-14Miscellaneous corrections to configuration Details S6-170258 agreedSA6#16BlackBerry UK L... Details SP-170390 approvedSA#76SA WG614.2.0MCImp-MC_ARCH
See details 23.28000331F14.1.0Rel-14Addition of MC service to group configuration request Details S6-170371 agreedSA6#16Motorola Solutions Details SP-170390 approvedSA#76SA WG614.2.0MCImp-MC_ARCH
See details 23.2800033-F14.1.0Rel-14Addition of MC service to group configuration request Details S6-170257 revisedSA6#16Motorola Solutions    MCImp-MC_ARCH
See details 23.28000262F14.1.0Rel-15Introduction of MC server initiated group de-affiliation procedure Details S6-170445 revisedSA6#16ZTE Corporation...    MCImp-MC_ARCH
See details 23.28000261F14.1.0Rel-15Introduction of MC server initiated group de-affiliation procedure Details S6-170372 revisedSA6#16ZTE Corporation...    MCImp-MC_ARCH
See details 23.2800026-F14.1.0Rel-14Introduction of MC server initiated group de-affiliation procedure Details S6-170240 revisedSA6#16ZTE Corporation...    MCImp-MC_ARCH
See details 23.28000241F14.1.0Rel-14Correction on Annex A Configuration data for MC services Details S6-170370 agreedSA6#16Ericsson Details SP-170390 approvedSA#76SA WG614.2.0MCImp-MC_ARCH
See details 23.2800024-F14.1.0Rel-14Correction on Annex A Configuration data for MC services Details S6-170235 revisedSA6#16Ericsson    MCImp-MC_ARCH
See details 23.28000231F14.0.0Rel-14Identities used in location information procedures Details S6-170114 agreedSA6#15Huawei, Hisilicon Details SP-170069 approvedSA#75SA WG614.1.0MCImp-MC_ARCH
See details 23.2800023-F14.0.0Rel-14Identities used in location information procedures Details S6-170079 revisedSA6#15Huawei, Hisilicon    MCImp-MC_ARCH
See details 23.28000221F14.0.0Rel-14Clarification that initial UE config and UE config are specific to one or more UEs Details S6-170111 agreedSA6#15BlackBerry UK L... Details SP-170069 approvedSA#75SA WG614.1.0MCImp-MC_ARCH
See details 23.2800022-F14.0.0Rel-14Clarification that initial UE config and UE config are specific to one or more UEs Details S6-170072 revisedSA6#15BlackBerry UK L...    MCImp-MC_ARCH
See details 23.2800021-F14.0.0Rel-14Location used in MBMS procedure Details S6-170045 postponedSA6#15Huawei, Hisilicon    MCImp-MC_ARCH
See details 23.28000203F14.0.0Rel-14Add location management entities and reference points in figure7.3.1-3 Details S6-170180 agreedSA6#15Huawei, Hisilicon Details SP-170069 approvedSA#75SA WG614.1.0MCImp-MC_ARCH
See details 23.28000202F14.0.0Rel-14Add location management entities and reference points in figure7.3.1-3 Details S6-170161 revisedSA6#15Huawei, Hisilicon    MCImp-MC_ARCH
See details 23.28000201F14.0.0Rel-14Add location management entities and reference points in figure7.3.1-3 Details S6-170113 revisedSA6#15Huawei, Hisilicon    MCImp-MC_ARCH
See details 23.2800020-F14.0.0Rel-14Add location management entities and reference points in figure7.3.1-3 Details S6-170044 revisedSA6#15Huawei, Hisilicon    MCImp-MC_ARCH
See details 23.2800016-F14.0.0Rel-14Correction for CSC-6 Details S6a170090 mergedSA6-MCImp-adhocHuawei, Hisilicon    MCImp-MC_ARCH
See details 23.28000152F14.0.0Rel-14Clarification on Editor’s notes in CFA Details S6a170185 agreedSA6-MCImp-adhocHuawei, Hisilicon Details SP-170069 approvedSA#75SA WG614.1.0MCImp-MC_ARCH
See details 23.28000151F14.0.0Rel-14Clarification on Editor’s notes in CFA Details S6a170156 revisedSA6-MCImp-adhocHuawei, Hisilicon    MCImp-MC_ARCH
See details 23.2800015-F14.0.0Rel-14Clarification on Editor’s notes in CFA Details S6a170087 revisedSA6-MCImp-adhocHuawei, Hisilicon    MCImp-MC_ARCH
See details 23.28000142D14.0.0Rel-14Resolving editor’s note on service continuity Details S6a170173 agreedSA6-MCImp-adhocNokia, Alcatel-... Details SP-170069 approvedSA#75SA WG614.1.0MCImp-MC_ARCH
See details 23.28000141D14.0.0Rel-14Resolving editor’s note on service continuity Details S6a170138 revisedSA6-MCImp-adhocNokia, Alcatel-...    MCImp-MC_ARCH
See details 23.2800014-D14.0.0Rel-14Resolving editor’s note on service continuity Details S6a170074 revisedSA6-MCImp-adhocNokia, Alcatel-...    MCImp-MC_ARCH
See details 23.28000136C14.0.0Rel-14Multiple MBMS servers EN removal Details S6-170160 postponedSA6#15Harris Corporat...    MCImp-MC_ARCH
See details 23.28000135C14.0.0Rel-14Multiple MBMS servers EN removal Details S6-170112 revisedSA6#15Harris Corporat...    MCImp-MC_ARCH
See details 23.28000134C14.0.0Rel-14Multiple MBMS servers EN removal Details S6-170029 revisedSA6#15Harris Corporat...    MCImp-MC_ARCH
See details 23.28000121F14.0.0Rel-14MBMS quality report clarifications Details S6a170142 agreedSA6-MCImp-adhocHarris Corporat... Details SP-170069 approvedSA#75SA WG614.1.0MCImp-MC_ARCH
See details 23.2800010-C14.0.0Rel-14group location information subscription Details S6a170054 postponedSA6-MCImp-adhocHytera Communic...    MCImp-MC_ARCH
See details 23.28000091F14.0.0Rel-14Corrections on group configuration tables Details S6a170155 agreedSA6-MCImp-adhocTD Tech Details SP-170069 approvedSA#75SA WG614.1.0MCImp-MC_ARCH
See details 23.2800009-F14.0.0Rel-14Corrections on group configuration tables Details S6a170048 revisedSA6-MCImp-adhocTD Tech    MCImp-MC_ARCH
See details 23.28000051F14.0.0Rel-14CFA correction of information flow for MBMS Details S6a170140 agreedSA6-MCImp-adhocEricsson LM Details SP-170069 approvedSA#75SA WG614.1.0MCImp-MC_ARCH
See details 23.28000031F14.0.0Rel-14Alignment of bearer management Details S6a170151 agreedSA6-MCImp-adhocBlackBerry UK L... Details SP-170069 approvedSA#75SA WG614.1.0MCImp-MC_ARCH
See details 23.2800003-F14.0.0Rel-14Alignment of bearer management Details S6a170018 revisedSA6-MCImp-adhocBlackBerry UK L...    MCImp-MC_ARCH
See details 23.28000022F14.0.0Rel-14Alignment of group affiliation and de-affiliation requirements Details S6a170181 agreedSA6-MCImp-adhocBlackBerry UK L... Details SP-170069 approvedSA#75SA WG614.1.0MCImp-MC_ARCH
See details 23.28000021F14.0.0Rel-14Alignment of group affiliation and de-affiliation requirements Details S6a170147 revisedSA6-MCImp-adhocBlackBerry UK L...    MCImp-MC_ARCH
See details 23.2800002-F14.0.0Rel-14Alignment of group affiliation and de-affiliation requirements Details S6a170014 revisedSA6-MCImp-adhocBlackBerry UK L...    MCImp-MC_ARCH
See details 23.28000011F14.0.0Rel-14Alignment of definitions Details S6a170143 agreedSA6-MCImp-adhocBlackBerry UK L... Details SP-170069 approvedSA#75SA WG614.1.0MCImp-MC_ARCH
See details 23.2800001-F14.0.0Rel-14Alignment of definitions Details S6a170010 revisedSA6-MCImp-adhocBlackBerry UK L...    MCImp-MC_ARCH
See details 23.37900081F14.0.0Rel-14Store and update affiliation status in the GMS Details S6a170161 agreedSA6-MCImp-adhocHuawei, Hisilicon Details SP-170069 approvedSA#75SA WG614.1.0MCImp-MC_ARCH