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 Spec #CR #Revision #CR CatImpacted VersionTarget ReleaseTitleWG TDoc #CR status at WGWG meeting refWG Source informationTSG TDoc #CR status at TSGTSG meeting refTSG Source informationNew VersionWork ItemsRemarks
See details 23.24604171F15.0.0Rel-16Change xMB reference Details S2-1901014 agreedSA2#130Qualcomm Incorp... Details SP-190175 approvedSA#83SA WG216.0.0TEI16, CAPIF4xMB
See details 23.2460417-F15.0.0Rel-16Change xMB reference Details S2-1900164 revisedSA2#130Qualcomm Incorp...    TEI16, CAPIF4xMB
See details 23.28500471F15.2.0Rel-16Change xMB reference Details S2-1901015 agreedSA2#130Qualcomm Incorp... Details SP-190175 approvedSA#83SA WG216.0.0TEI16, CAPIF4xMB
See details 23.2850047-F15.2.0Rel-16Change xMB reference Details S2-1900165 revisedSA2#130Qualcomm Incorp...    TEI16, CAPIF4xMB
See details 23.68204251F16.1.0Rel-16Change xMB reference Details S2-1901016 agreedSA2#130Qualcomm Incorp... Details SP-190175 approvedSA#83SA WG216.2.0TEI16, CAPIF4xMB
See details 23.6820425-F16.1.0Rel-16Change xMB reference Details S2-1900166 revisedSA2#130Qualcomm Incorp...    TEI16, CAPIF4xMB
See details 26.34606211D15.2.0Rel-16Moving xMB to 26.348 Details S4-181422 agreedSA4#101ENENSYS Details SP-180979 approvedSA#82SA WG416.0.0CAPIF4xMB
See details 26.3480005-F16.1.0Rel-16CR 26.348-0005 on Correction of xMB Guidelines (Release 16) Details S4-190565 agreedSA4#103Ericsson LM, Expway Details SP-190340 approvedSA#84SA WG416.2.0CAPIF4xMB