|
|
| 23.222 | 0223 | - | F | 18.6.0 | Rel-18 | recover Service API category in Interconnection API publish request |
S6-245092
| | SA6#64 | ZTE Corporation |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0057 | - | B | 16.2.0 | Rel-16 | Updates to CAPIF events procedures for 3rd party trust domain |
S6-190385
| agreed | SA6#29 | Samsung Electronics |
SP-190072
| approved | SA#83 | SA WG6 | 16.3.0 | eCAPIF |
|
|
|
| 23.222 | 0056 | 1 | B | 16.2.0 | Rel-16 | Updates to AMF procedures for 3rd party trust domain |
S6-190427
| agreed | SA6#29 | Samsung Electronics |
SP-190072
| approved | SA#83 | SA WG6 | 16.3.0 | eCAPIF |
|
|
|
| 23.222 | 0056 | - | B | 16.2.0 | Rel-16 | Updates to AMF procedures for 3rd party trust domain |
S6-190384
| revised | SA6#29 | Samsung Electronics |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0055 | 1 | B | 16.2.0 | Rel-16 | Updates to APF procedures for 3rd party trust domain |
S6-190426
| agreed | SA6#29 | Samsung Electronics |
SP-190072
| approved | SA#83 | SA WG6 | 16.3.0 | eCAPIF |
|
|
|
| 23.222 | 0055 | - | B | 16.2.0 | Rel-16 | Updates to APF procedures for 3rd party trust domain |
S6-190383
| revised | SA6#29 | Samsung Electronics |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0054 | 1 | B | 16.2.0 | Rel-16 | Updates to AEF procedures for 3rd party trust domain |
S6-190425
| agreed | SA6#29 | Samsung Electronics |
SP-190072
| approved | SA#83 | SA WG6 | 16.3.0 | eCAPIF |
|
|
|
| 23.222 | 0054 | - | B | 16.2.0 | Rel-16 | Updates to AEF procedures for 3rd party trust domain |
S6-190382
| revised | SA6#29 | Samsung Electronics |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0053 | 2 | B | 16.2.0 | Rel-16 | Procedures for registration of API provider domain functions |
S6-190494
| agreed | SA6#29 | Samsung Electronics |
SP-190072
| approved | SA#83 | SA WG6 | 16.3.0 | eCAPIF |
|
|
|
| 23.222 | 0053 | 1 | B | 16.2.0 | Rel-16 | Procedures for registration of API provider domain functions |
S6-190424
| revised | SA6#29 | Samsung Electronics |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0053 | - | B | 16.2.0 | Rel-16 | Procedures for registration of API provider domain functions |
S6-190381
| revised | SA6#29 | Samsung Electronics |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0052 | 1 | B | 16.2.0 | Rel-16 | Architectural requirements for registration of API provider domain functions |
S6-190423
| agreed | SA6#29 | Samsung Electronics |
SP-190072
| approved | SA#83 | SA WG6 | 16.3.0 | eCAPIF |
|
|
|
| 23.222 | 0052 | - | B | 16.2.0 | Rel-16 | Architectural requirements for registration of API provider domain functions |
S6-190380
| revised | SA6#29 | Samsung Electronics |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0051 | 2 | B | 16.2.0 | Rel-16 | Service API discover for CAPIF interconnection |
S6-190496
| agreed | SA6#29 | Huawei, Hisilicon |
SP-190072
| approved | SA#83 | SA WG6 | 16.3.0 | eCAPIF |
|
|
|
| 23.222 | 0051 | 1 | B | 16.2.0 | Rel-16 | Service API discover for CAPIF interconnection |
S6-190430
| revised | SA6#29 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0051 | - | B | 16.2.0 | Rel-16 | Service API discover for CAPIF interconnection |
S6-190361
| revised | SA6#29 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0050 | 2 | B | 16.2.0 | Rel-16 | Multiple CCFs deployment in a PLMN trust domain |
S6-190495
| agreed | SA6#29 | Huawei, Hisilicon |
SP-190072
| approved | SA#83 | SA WG6 | 16.3.0 | eCAPIF |
|
|
|
| 23.222 | 0050 | 1 | B | 16.2.0 | Rel-16 | Multiple CCFs deployment in a PLMN trust domain |
S6-190429
| revised | SA6#29 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0050 | - | B | 16.2.0 | Rel-16 | Multiple CCFs deployment in a PLMN trust domain |
S6-190360
| revised | SA6#29 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0049 | 1 | B | 16.2.0 | Rel-16 | Service API discovery involving multiple CCFs |
S6-190428
| agreed | SA6#29 | Huawei, Hisilicon |
SP-190072
| approved | SA#83 | SA WG6 | 16.3.0 | eCAPIF |
|
|
|
| 23.222 | 0049 | - | B | 16.2.0 | Rel-16 | Service API discovery involving multiple CCFs |
S6-190359
| revised | SA6#29 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0048 | 1 | C | 16.2.0 | Rel-16 | Interactions between API exposing functions |
S6-190177
| agreed | SA6#28 | Huawei, Hisilicon |
SP-190072
| approved | SA#83 | SA WG6 | 16.3.0 | eCAPIF |
|
|
|
| 23.222 | 0048 | - | C | 16.2.0 | Rel-16 | Interactions between API exposing functions |
S6-190142
| revised | SA6#28 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0047 | 1 | B | 16.2.0 | Rel-16 | CAPIF new architectural requirements |
S6-190173
| postponed | SA6#28 | Samsung |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0047 | - | B | 16.2.0 | Rel-16 | CAPIF new architectural requirements |
S6-190110
| revised | SA6#28 | Samsung |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0046 | 2 | B | 16.2.0 | Rel-16 | API invocation request routing with topology hiding |
S6-190277
| agreed | SA6#28 | Huawei, Hisilicon |
SP-190072
| approved | SA#83 | SA WG6 | 16.3.0 | eCAPIF |
|
|
|
| 23.222 | 0046 | 1 | B | 16.2.0 | Rel-16 | API invocation request routing with topology hiding |
S6-190176
| revised | SA6#28 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0046 | - | B | 16.2.0 | Rel-16 | API invocation request routing with topology hiding |
S6-190086
| revised | SA6#28 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0045 | 2 | B | 16.2.0 | Rel-16 | API sharing for CCF interconnection |
S6-190261
| agreed | SA6#28 | Huawei, Hisilicon |
SP-190072
| approved | SA#83 | SA WG6 | 16.3.0 | eCAPIF |
|
|
|
| 23.222 | 0045 | 1 | B | 16.2.0 | Rel-16 | API sharing for CCF interconnection |
S6-190175
| revised | SA6#28 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0045 | - | B | 16.2.0 | Rel-16 | API sharing for CCF interconnection |
S6-190085
| revised | SA6#28 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0044 | 2 | F | 16.2.0 | Rel-16 | Update procedures with topology hidding |
S6-190260
| agreed | SA6#28 | Huawei, Hisilicon |
SP-190072
| approved | SA#83 | SA WG6 | 16.3.0 | eCAPIF |
|
|
|
| 23.222 | 0044 | 1 | F | 16.2.0 | Rel-16 | Update procedures with topology hidding |
S6-190174
| revised | SA6#28 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0044 | - | F | 16.2.0 | Rel-16 | Update procedures with topology hidding |
S6-190084
| revised | SA6#28 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0039 | 2 | B | 16.1.0 | Rel-16 | Update API invoker API list |
S6-181563
| agreed | SA6#26 | Samsung |
SP-181176
| approved | SA#82 | SA WG6 | 16.2.0 | eCAPIF |
|
|
|
| 23.222 | 0039 | 1 | B | 16.1.0 | Rel-16 | Update API invoker API list |
S6-181508
| revised | SA6#26 | Samsung |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0039 | - | B | 16.1.0 | Rel-16 | Update API invoker profile |
S6-181418
| revised | SA6#26 | Samsung |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0038 | 2 | B | 16.1.0 | Rel-16 | Architectural requirements for provider domain entities interaction |
S6-181562
| agreed | SA6#26 | Samsung |
SP-181176
| approved | SA#82 | SA WG6 | 16.2.0 | eCAPIF |
|
|
|
| 23.222 | 0038 | 1 | B | 16.1.0 | Rel-16 | Architectural requirements for provider domain entities interaction |
S6-181541
| revised | SA6#26 | Samsung |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0038 | - | B | 16.1.0 | Rel-16 | Architectural requirements for provider domain entities interaction |
S6-181417
| revised | SA6#26 | Samsung |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0037 | 1 | B | 16.1.0 | Rel-16 | Architectural requirements for user level authorization |
S6-181505
| postponed | SA6#26 | Samsung |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0037 | - | B | 16.1.0 | Rel-16 | Architectural requirements for user level authorization |
S6-181416
| revised | SA6#26 | Samsung |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0036 | 1 | C | 16.1.0 | Rel-16 | Architectural requirements for identities |
S6-181504
| agreed | SA6#26 | Samsung |
SP-181176
| approved | SA#82 | SA WG6 | 16.2.0 | eCAPIF |
|
|
|
| 23.222 | 0036 | - | C | 16.1.0 | Rel-16 | Architectural requirements for identities |
S6-181415
| revised | SA6#26 | Samsung |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0035 | 2 | B | 16.1.0 | Rel-16 | API publish and API discover for CAPIF interconnection |
S6-181559
| agreed | SA6#26 | Huawei, Hisilicon |
SP-181176
| approved | SA#82 | SA WG6 | 16.2.0 | eCAPIF |
|
|
|
| 23.222 | 0035 | 1 | B | 16.1.0 | Rel-16 | API publish and API discover for CAPIF interconnection |
S6-181507
| revised | SA6#26 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0035 | - | B | 16.1.0 | Rel-16 | API publish and API discover for CAPIF interconnection |
S6-181382
| revised | SA6#26 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0034 | 3 | B | 16.1.0 | Rel-16 | Topology hiding enhancement |
S6-181585
| agreed | SA6#26 | Huawei, Hisilicon |
SP-181176
| approved | SA#82 | SA WG6 | 16.2.0 | eCAPIF |
|
|
|
| 23.222 | 0034 | 2 | B | 16.1.0 | Rel-16 | Topology hiding enhancement |
S6-181558
| revised | SA6#26 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0034 | 1 | B | 16.1.0 | Rel-16 | Topology hiding enhancement |
S6-181506
| revised | SA6#26 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0034 | - | B | 16.1.0 | Rel-16 | Topology hiding enhancement |
S6-181381
| revised | SA6#26 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0033 | 3 | B | 16.0.0 | Rel-16 | Functional architecture for CAPIF interconnection |
S6-181268
| agreed | SA6#25 | Huawei, Hisilicon |
SP-180675
| approved | SA#81 | SA WG6 | 16.1.0 | eCAPIF |
|
|
|
| 23.222 | 0033 | 2 | B | 16.0.0 | Rel-16 | Functional architecture for CAPIF interconnection |
S6-181225
| revised | SA6#25 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0033 | 1 | B | 16.0.0 | Rel-16 | Functional architecture for CAPIF interconnection |
S6-181139
| revised | SA6#25 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0033 | - | B | 16.0.0 | Rel-16 | Functional architecture for CAPIF interconnection |
S6-181114
| revised | SA6#25 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0032 | - | A | 16.0.0 | Rel-16 | eCAPIF-mirror-Alignment to SA3 authentication procedure |
S6-181090
| revised | SA6#25 | Samsung |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0031 | - | A | 16.0.0 | Rel-16 | eCAPIF-mirror-Alignment to SA3 CAPIF TS |
S6-181089
| revised | SA6#25 | Samsung |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0030 | 1 | A | 16.0.0 | Rel-16 | eCAPIF-mirror-alignment of APIs |
S6-181131
| revised | SA6#25 | Samsung |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0030 | - | A | 16.0.0 | Rel-16 | eCAPIF-mirror-alignment of APIs |
S6-181088
| revised | SA6#25 | Samsung |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0029 | - | A | 16.0.0 | Rel-16 | CAPIF-mirror-Update API naming convention |
S6-181087
| revised | SA6#25 | Samsung |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0024 | - | B | 16.0.0 | Rel-16 | Supporting MEC with CAPIF |
S6-181079
| not pursued | SA6#25 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0023 | 2 | B | 16.0.0 | Rel-16 | Enhancement to reference points for eCAPIF |
S6-181224
| agreed | SA6#25 | China Telecom, ... |
SP-180675
| approved | SA#81 | SA WG6 | 16.1.0 | eCAPIF |
|
|
|
| 23.222 | 0023 | 1 | B | 16.0.0 | Rel-16 | Enhancement to reference points for eCAPIF |
S6-181138
| revised | SA6#25 | China Telecom, ... |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0023 | - | F | 16.0.0 | Rel-16 | Enhancement to reference points for eCAPIF |
S6-181011
| revised | SA6#25 | China Telecommu... |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0022 | 1 | C | 16.0.0 | Rel-16 | Enhancement to the functional model deployments |
S6-181137
| agreed | SA6#25 | China Telecom, ... |
SP-180675
| approved | SA#81 | SA WG6 | 16.1.0 | eCAPIF |
|
|
|
| 23.222 | 0022 | - | C | 16.0.0 | Rel-16 | Enhancement to the functional model deployments |
S6-180979
| revised | SA6#25 | China Telecommu... |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0021 | 2 | B | 16.0.0 | Rel-16 | Integrated CAPIF with 3GPP EPS and 5GS network exposure |
S6-181223
| agreed | SA6#25 | China Telecom, ... |
SP-180675
| approved | SA#81 | SA WG6 | 16.1.0 | eCAPIF |
|
|
|
| 23.222 | 0021 | 1 | B | 16.0.0 | Rel-16 | integrated CAPIF with 3GPP EPS and 5GS network exposure |
S6-181136
| revised | SA6#25 | China Telecommu... |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0021 | - | B | 16.0.0 | Rel-16 | integrated CAPIF with 3GPP EPS and 5GS network exposure |
S6-180978
| revised | SA6#25 | China Telecommu... |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0020 | 2 | D | 15.1.0 | Rel-16 | CAPIF-Updating representation of deployment models |
S6-180928
| agreed | SA6#24 | SAMSUNG |
SP-180375
| approved | SA#80 | SA WG6 | 16.0.0 | eCAPIF |
|
|
|
| 23.222 | 0020 | 1 | D | 15.1.0 | Rel-16 | CAPIF-Updating representation of deployment models |
S6-180861
| revised | SA6#24 | SAMSUNG |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0020 | - | D | 15.1.0 | Rel-16 | CAPIF-Updating representation of deployment models |
S6-180812
| revised | SA6#24 | SAMSUNG |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0018 | 2 | B | 15.1.0 | Rel-16 | CAPIF interconnection requirements |
S6-180707
| agreed | SA6#23 | Huawei, Hisilicon |
SP-180375
| approved | SA#80 | SA WG6 | 16.0.0 | eCAPIF |
|
|
|
| 23.222 | 0018 | 1 | B | 15.1.0 | Rel-16 | CAPIF interconnection requirements |
S6-180622
| revised | SA6#23 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0018 | - | B | 15.1.0 | Rel-16 | CAPIF interconnection requirements |
S6-180570
| revised | SA6#23 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0017 | 1 | B | 15.1.0 | Rel-16 | OAM requirements for 3rd party API providers |
S6-180621
| agreed | SA6#23 | Huawei, Hisilicon |
SP-180375
| approved | SA#80 | SA WG6 | 16.0.0 | eCAPIF |
|
|
|
| 23.222 | 0017 | - | B | 15.1.0 | Rel-16 | OAM requirements for 3rd party API providers |
S6-180569
| revised | SA6#23 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0016 | 1 | B | 15.1.0 | Rel-16 | Charging requirements for 3rd party API providers |
S6-180620
| agreed | SA6#23 | Huawei, Hisilicon |
SP-180375
| approved | SA#80 | SA WG6 | 16.0.0 | eCAPIF |
|
|
|
| 23.222 | 0016 | - | B | 15.1.0 | Rel-16 | Charging requirements for 3rd party API providers |
S6-180568
| revised | SA6#23 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0015 | 1 | B | 15.1.0 | Rel-16 | Service API publish and discovery requirements for 3rd party API providers |
S6-180619
| agreed | SA6#23 | Huawei, Hisilicon |
SP-180375
| approved | SA#80 | SA WG6 | 16.0.0 | eCAPIF |
|
|
|
| 23.222 | 0015 | - | B | 15.1.0 | Rel-16 | Service API publish and discovery requirements for 3rd party API providers |
S6-180567
| revised | SA6#23 | Huawei, Hisilicon |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0012 | 2 | B | 15.1.0 | Rel-16 | Architecture functional model to support multiple API providers |
S6-180684
| agreed | SA6#23 | SAMSUNG |
SP-180375
| approved | SA#80 | SA WG6 | 16.0.0 | eCAPIF |
|
|
|
| 23.222 | 0012 | 1 | B | 15.1.0 | Rel-16 | Architecture functional model to support multiple API providers |
S6-180623
| revised | SA6#23 | SAMSUNG |
| | | | | eCAPIF |
|
|
|
| 23.222 | 0012 | - | B | 15.1.0 | Rel-16 | Architecture functional model to support multiple API providers |
S6-180552
| revised | SA6#23 | SAMSUNG |
| | | | | eCAPIF |
|