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17 items in 1 pages

		Spec #	CR #	Revision #	CR Cat	Impacted Version	Target Release	Title	WG TDoc #	CR status at WG	WG meeting ref	WG Source information	TSG TDoc #	CR status at TSG	TSG meeting ref	TSG Source information	New Version	Work Items	Remarks


		36.306	1878	1	B	18.0.0	Rel-18	Lower MSD capability for EN-DC	R2-2401947	agreed	RAN2#125	Huawei, HiSilic...	RP-240683	approved	RAN#103	RAN2	18.1.0	NR_ENDC_RF_FR1_enh2
		36.306	1878	-	B	18.0.0	Rel-18	Lower MSD capability for EN-DC	R2-2400726	revised	RAN2#125	Huawei, HiSilic...						NR_ENDC_RF_FR1_enh2
		36.331	4991	1	B	18.0.0	Rel-18	Lower MSD capability for EN-DC	R2-2401946	agreed	RAN2#125	Huawei, HiSilic...	RP-240683	approved	RAN#103	RAN2	18.1.0	NR_ENDC_RF_FR1_enh2
		36.331	4991	-	B	18.0.0	Rel-18	Lower MSD capability for EN-DC	R2-2400725	revised	RAN2#125	Huawei, HiSilic...						NR_ENDC_RF_FR1_enh2
		38.101-1	1497	-	B	18.1.0	Rel-18	Big CR to TS 38.101-1 4Tx requirements (phase 1)	R4-2307144	endorsed	RAN4#107	Huawei, HiSilic...						NR_ENDC_RF_FR1_enh2
		38.306	1031	1	B	18.0.0	Rel-18	Lower MSD capability for EN-DC	R2-2401945	merged	RAN2#125	Huawei, HiSilic...						NR_ENDC_RF_FR1_enh2
		38.306	1031	-	B	18.0.0	Rel-18	Lower MSD capability for EN-DC	R2-2400724	revised	RAN2#125	Huawei, HiSilic...						NR_ENDC_RF_FR1_enh2
		38.306	0950	3	B	17.6.0	Rel-18	Introduction of lower MSD capability	R2-2313633	endorsed	RAN2#124	Huawei, HiSilicon						NR_ENDC_RF_FR1_enh2
		38.306	0950	2	B	17.6.0	Rel-18	Introduction of lower MSD capability	R2-2313471	revised	RAN2#124	Huawei, HiSilicon						NR_ENDC_RF_FR1_enh2
		38.306	0950	1	B	17.6.0	Rel-18	Introduction of lower MSD capability	R2-2310736	revised	RAN2#123-bis	Huawei, HiSilicon						NR_ENDC_RF_FR1_enh2
		38.306	0950	-	B	17.5.0	Rel-18	Introduction of lower MSD capability	R2-2308865	revised	RAN2#123	Huawei, HiSilicon						NR_ENDC_RF_FR1_enh2
		38.331	4542	1	B	18.0.0	Rel-18	Lower MSD capability for EN-DC	R2-2401944	merged	RAN2#125	Huawei, HiSilic...						NR_ENDC_RF_FR1_enh2
		38.331	4542	-	B	18.0.0	Rel-18	Lower MSD capability for EN-DC	R2-2400723	revised	RAN2#125	Huawei, HiSilic...						NR_ENDC_RF_FR1_enh2
		38.331	4292	3	B	17.6.0	Rel-18	Introduction of lower MSD capability	R2-2313629	endorsed	RAN2#124	Huawei, HiSilicon						NR_ENDC_RF_FR1_enh2
		38.331	4292	2	B	17.6.0	Rel-18	Introduction of lower MSD capability	R2-2313470	revised	RAN2#124	Huawei, HiSilicon						NR_ENDC_RF_FR1_enh2
		38.331	4292	1	B	17.6.0	Rel-18	Introduction of lower MSD capability	R2-2310735	revised	RAN2#123-bis	Huawei, HiSilicon						NR_ENDC_RF_FR1_enh2
		38.331	4292	-	B	17.5.0	Rel-18	Introduction of lower MSD capability	R2-2308864	revised	RAN2#123	Huawei, HiSilicon						NR_ENDC_RF_FR1_enh2