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| 36.113 | 0088 | 1 | F | 17.1.0 | Rel-18 | CR to TS 36.113: framework for the EMC-specific manufacturer's declarations, Rel-18 |
R4-2313913
| endorsed | RAN4#108 | Huawei, HiSilicon |
| | | | | TEI18, NR_LTE_E... |
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| 36.113 | 0088 | - | F | 17.1.0 | Rel-18 | CR to TS 36.113: framework for the EMC-specific manufacturer's declarations, Rel-18 |
R4-2313611
| revised | RAN4#108 | Huawei, HiSilicon |
| | | | | TEI18, NR_LTE_E... |
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| 36.124 | 0062 | - | B | 17.1.0 | Rel-18 | CR to 36.124: EMC requirements simplifications for CA and DC combinations, Rel-18 |
R4-2320831
| agreed | RAN4#109 | Huawei, HiSilicon |
RP-233364
| approved | RAN#102 | RAN4 | 18.0.0 | NR_LTE_EMC_enh-Perf |
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| 37.113 | 0129 | 1 | B | 17.2.0 | Rel-18 | CR to TS 37.113 Implementation of EMC enhancement |
R4-2321067
| agreed | RAN4#109 | Ericsson, Nokia... |
RP-233364
| approved | RAN#102 | RAN4 | 18.0.0 | NR_LTE_EMC_enh-Perf |
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| 37.113 | 0129 | - | B | 17.2.0 | Rel-18 | CR to TS 37.113 Implementation of EMC enhancement |
R4-2320499
| revised | RAN4#109 | Ericsson, Nokia... |
| | | | | NR_LTE_EMC_enh-Perf |
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| 37.113 | 0128 | - | F | 17.2.0 | Rel-18 | CR to TS 37.113: framework for the EMC-specific manufacturer's declarations, Rel-18 |
R4-2313608
| not pursued | RAN4#108 | Huawei, HiSilicon |
| | | | | TEI18, NR_LTE_E... |
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| 37.113 | 0127 | - | B | 17.2.0 | Rel-18 | CR to TS 37.113 Implementation of EMC enhancements |
R4-2312913
| not pursued | RAN4#108 | Ericsson |
| | | | | NR_LTE_EMC_enh-Perf |
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| 37.113 | 0126 | - | B | 17.1.0 | Rel-17 | CR to TS 37.113 Implementation of EMC enhancements |
R4-2308998
| not pursued | RAN4#107 | Ericsson |
| | | | | NR_LTE_EMC_enh-Perf |
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| 37.114 | 0112 | - | F | 18.0.0 | Rel-18 | (NR_LTE_EMC_enh-Perf) CR to TS 37.114 on correction of example used in Annex A |
R4-2402814
| agreed | RAN4#110 | Ericsson |
RP-240607
| approved | RAN#103 | RAN4 | 18.1.0 | NR_LTE_EMC_enh-Perf |
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| 37.114 | 0111 | - | F | 18.0.0 | Rel-18 | (NR_LTE_EMC_enh-Perf) CR to TS 37.114 on correction of example used in Annex A |
R4-2402793
| | RAN4#110 | Ericsson |
| | | | | NR_LTE_EMC_enh-Perf |
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| 37.114 | 0110 | - | F | 18.0.0 | Rel-18 | (NR_LTE_EMC_enh-Perf) CR to TS 37.114 on correction of example used in Annex A |
R4-2402763
| | RAN4#110 | Ericsson |
| | | | | NR_LTE_EMC_enh-Perf |
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| 37.114 | 0109 | 1 | B | 17.1.0 | Rel-18 | CR to TS 37.114: Implementation of AAS BS testing simplifications, Rel-18 |
R4-2321068
| agreed | RAN4#109 | Huawei, HiSilicon |
RP-233364
| approved | RAN#102 | RAN4 | 18.0.0 | NR_LTE_EMC_enh-Perf |
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| 37.114 | 0109 | - | B | 17.1.0 | Rel-18 | CR to TS 37.114: Implementation of AAS BS testing simplifications, Rel-18 |
R4-2320825
| revised | RAN4#109 | Huawei, HiSilicon |
| | | | | NR_LTE_EMC_enh-Perf |
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| 37.114 | 0107 | - | F | 17.1.0 | Rel-18 | CR to TS 37.114: framework for the EMC-specific manufacturer's declarations, Rel-18 |
R4-2313609
| not pursued | RAN4#108 | Huawei, HiSilicon |
| | | | | TEI18, NR_LTE_E... |
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| 38.113 | 0064 | 1 | F | 17.4.0 | Rel-18 | CR to TS 38.113: framework for the EMC-specific manufacturer's declarations, Rel-18 |
R4-2313995
| endorsed | RAN4#108 | Huawei, HiSilicon |
| | | | | TEI18, NR_LTE_E... |
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| 38.113 | 0064 | - | F | 17.4.0 | Rel-18 | CR to TS 38.113: framework for the EMC-specific manufacturer's declarations, Rel-18 |
R4-2313610
| revised | RAN4#108 | Huawei, HiSilicon |
| | | | | TEI18, NR_LTE_E... |
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