Specification #: 25.827
Reference: 25.827
Title: 1.28 Mcps TDD ehanced uplink; Physical layer aspects
Status: Under change control
Type: Technical report (TR)
Initial planned Release: Release 7
Internal:
Common IMS Specification:
Radio technology:
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Remarks (1)
Creation dateAuthorRemark
2017-07-04 10:46 UTC
John M Meredith
Txferred from RAN1 to RAN6.
History
Action dateActionAuthor
2017-07-04 10:56 UTC
Txferred from RAN1 to RAN6.
John M Meredith
Primary responsible group: RAN 6
Secondary responsible groups: RAN 1
Rapporteurs
NameCompany
Ke Wang
CATT
44224
Parent Specifications
Spec #TypeTitleStatusPrime grp 
No related specifications
progress
Child Specifications
Spec #TypeTitleStatusPrime grp 
No related specifications
progress
Related Work Items
UIDAcronymTitleResp. grp(s) 
20056
LCRTDD-EDCH-Phys
1.28 Mcps TDD Enhanced Uplink: Physical Layer
R1
See details True
1222
LCRTDD
Low Chip Rate TDD option
R1
See details False
20003
EDCH
FDD Enhanced Uplink
R1 , R2 , R3 , R4 , R5
See details False
20005
EDCH-Phys
FDD Enhanced Uplink - Physical Layer
R1
See details False
20055
LCRTDD-EDCH
1.28 Mcps TDD Enhanced Uplink
R1 , R2 , R3 , R4 , R5
See details False
35016
CH
Rel-6 Charging Management
N3 , S2 , S5
See details False
  • MeetingsVersionUpload dateComment 
    2007-06-21
    25056RAN#3621163
    2007-03-22
    25053RAN#3518202
    2007-03-19
    RP-070134
    25053RAN#351708
    2006-11-28
    RP-060771 ex R1-47
    24398RAN#343616
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