WI # 20006 - EDCH-L23
General
Related
Name:
FDD Enhanced Uplink - Layer 2 and 3 Protocol Aspects
Acronym:
EDCH-L23
Effective Acronym:
EDCH-L23
WI Level:
Building Block (2nd level)
Type:
Work Item
Status:
Awaiting approval
Release:
Rel-6
Start date:
2004-03-15
End date:
2005-03-14
Remarks (0)
Creation date
Author
Remark
No Remarks Added
Parent Work Item:
20003
- FDD Enhanced Uplink
Child Work Items:
WI UID
WI name
No records to display.
Responsible group(s):
R2
Rapporteur(s):
Ericsson
Latest WID version:
-
TSG Approval meeting:
-
PCG Approval meeting:
-
TSG Stopped meeting:
-
PCG Stopped meeting:
-
See Specifications specifically resulting from this Work Item
See all related Change Requests related to this Work Item (all specifications)
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