WI # 2478 - HSDPA-L23
Name: Layer 2 and 3 aspects
Acronym: HSDPA-L23
Effective Acronym: HSDPA-L23
WI Level: Building Block (2nd level)
Type: Work Item
Status: Awaiting approval
Release: Rel-5
Start date: 2001-04-05
End date: 2002-03-29
Remarks (0)
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Parent Work Item: 2476 - High Speed Downlink Packet Access
Child Work Items:
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Responsible group(s): R2
Rapporteur(s): Motorola
Latest WID version: -
TSG Approval meeting: -
PCG Approval meeting: -
TSG Stopped meeting: -
PCG Stopped meeting: -
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