WI # 2478 - HSDPA-L23
Name: Layer 2 and 3 aspects
Acronym: HSDPA-L23
Effective Acronym: HSDPA-L23
WI Level: Building Block (2nd level)
Type: Work Item
Status: Awaiting approval
Release: Rel-5
Start date: 2001-04-05
End date: 2002-03-29
Remarks (0)
Creation dateAuthorRemark
No Remarks Added
Parent Work Item: 2476 - High Speed Downlink Packet Access
Child Work Items:
WI UIDWI name
No records to display.
Responsible group(s): R2
Rapporteur(s): Motorola
Latest WID version: -
TSG Approval meeting: -
PCG Approval meeting: -
TSG Stopped meeting: -
PCG Stopped meeting: -
See Specifications specifically resulting from this Work Item
See all related Change Requests related to this Work Item (all specifications)
Exit