WI # 31084 - MBMSE
General
Related
Name:
MBMS Enhancements
Acronym:
MBMSE
Effective Acronym:
MBMSE
WI Level:
Feature (1st level)
Type:
Work Item
Status:
Awaiting approval
Release:
Rel-7
Start date:
2005-07-11
End date:
2007-11-30
Remarks (0)
Creation date
Author
Remark
No Remarks Added
Parent Work Item:
None
Child Work Items:
WI UID
WI name
340041
Stage 1 of MBMSE
340042
MBMS FDD Physical layer Enhancements
340043
MBMS TDD Physical layer Enhancements
340046
MBMS Mz interface
350022
MBMS Low Chip Rate TDD Physical Layer Enhancement
Responsible group(s):
R1
,
S1
,
C3
Rapporteur(s):
Hong Liu
(China Mobile)
Latest WID version:
SP-050389
TSG Approval meeting:
-
PCG Approval meeting:
-
TSG Stopped meeting:
-
PCG Stopped meeting:
-
See Specifications specifically resulting from this Work Item
See all related Change Requests related to this Work Item (all specifications)
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