WI # 370017 - SAES-DIAM
General
Related
Name:
Unified guidelines for Diameter usage within 3GPP
Acronym:
SAES-DIAM
Effective Acronym:
SAES-DIAM
WI Level:
Work Task (3rd Level)
Type:
Work Item
Status:
PCG approved
Release:
Rel-8
Start date:
2007-09-21
End date:
2008-12-05
Remarks (1)
Creation date
Author
Remark
2015-01-22 12:40 UTC
CP#42 completed
Parent Work Item:
370005
- High level and common (for all accesses) functions
Child Work Items:
WI UID
WI name
No records to display.
Responsible group(s):
C3
Rapporteur(s):
Huawei
Latest WID version:
CP-080055
TSG Approval meeting:
37
PCG Approval meeting:
19
TSG Stopped meeting:
-
PCG Stopped meeting:
-
See Specifications specifically resulting from this Work Item
See all related Change Requests related to this Work Item (all specifications)
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