WI # 870094 - TEI17_N3SLICE
General
Related
Name:
Support of different slices over different Non 3GPP access
Acronym:
TEI17_N3SLICE
Effective Acronym:
TEI17_N3SLICE
WI Level:
Building Block (2nd level)
Type:
Work Item
Status:
Awaiting approval
Release:
Rel-17
Start date:
2019-03-07
End date:
2019-03-07
Remarks (0)
Creation date
Author
Remark
No Remarks Added
Parent Work Item:
850047
- (Small) Technical Enhancements and Improvements for Rel-17
Child Work Items:
WI UID
WI name
No records to display.
Responsible group(s):
S2
Rapporteur(s):
puneet.jain@intel.com
(Puneet Jain, Intel)
Latest WID version:
-
TSG Approval meeting:
-
PCG Approval meeting:
-
TSG Stopped meeting:
-
PCG Stopped meeting:
-
See Specifications specifically resulting from this Work Item
See all related Change Requests related to this Work Item (all specifications)
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