WI # 2217

Name:

Testing Layer 2 and layer 3 protocol aspects

Acronym:

Effective Acronym:

WI Level:

Work Task (3rd Level)

Type:

Work Item

Status:

Awaiting approval

Release:

Rel-4

Start date:

2001-09-17

End date:

2003-07-02

Remarks (1)

Creation date	Author	Remark


2015-01-22 12:41 UTC		Marked as closed 12/2008 (was marked 60% complete)

Parent Work Item:

2103 - Conformance Test Aspects - Low Chip Rate TDD

Child Work Items:

WI UID	WI name


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Responsible group(s):

Rapporteur(s):

Latest WID version:

TP-030052

TSG Approval meeting:

PCG Approval meeting:

TSG Stopped meeting:

PCG Stopped meeting:

See Specifications specifically resulting from this Work Item

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