WI # 2103

Name:

Conformance Test Aspects - Low Chip Rate TDD

Acronym:

Effective Acronym:

WI Level:

Building Block (2nd level)

Type:

Work Item

Status:

Awaiting approval

Release:

Rel-4

Start date:

2001-09-17

End date:

2003-12-02

Remarks (0)

Creation date	Author	Remark


No Remarks Added

Parent Work Item:

1222 - Low Chip Rate TDD option

Child Work Items:

WI UID	WI name


2217	Testing Layer 2 and layer 3 protocol aspects
2218	Testing RF Radio Transmission and Reception
2562	Deleted - Testing Layer 2 and layer 3 protocol aspects - TTCN

Responsible group(s):

Rapporteur(s):

Latest WID version:

TSG Approval meeting:

PCG Approval meeting:

TSG Stopped meeting:

PCG Stopped meeting:

See Specifications specifically resulting from this Work Item

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