WI # 2103
Name: Conformance Test Aspects - Low Chip Rate TDD
Effective Acronym:
WI Level: Building Block (2nd level)
Type: Work Item
Status: Awaiting approval
Release: Rel-4
Start date: 2001-09-17
End date: 2003-12-02
Remarks (0)
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Parent Work Item: 1222 - Low Chip Rate TDD option
Child Work Items:
Testing Layer 2 and layer 3 protocol aspects
Testing RF Radio Transmission and Reception
Deleted - Testing Layer 2 and layer 3 protocol aspects - TTCN
Responsible group(s): T1
Latest WID version: -
TSG Approval meeting: -
PCG Approval meeting: -
TSG Stopped meeting: -
PCG Stopped meeting: -
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See all related Change Requests related to this Work Item (all specifications)