WI # 2562
General
Related
Name:
Deleted - Testing Layer 2 and layer 3 protocol aspects - TTCN
Acronym:
Effective Acronym:
WI Level:
Work Task (3rd Level)
Type:
Work Item
Status:
TSG stopped
Release:
Rel-4
Start date:
2002-12-03
End date:
2003-12-02
Remarks (1)
Creation date
Author
Remark
2015-01-22 12:41 UTC
Marked as stopped 12/2008
Parent Work Item:
2103
- Conformance Test Aspects - Low Chip Rate TDD
Child Work Items:
WI UID
WI name
No records to display.
Responsible group(s):
T1
Rapporteur(s):
Latest WID version:
TP-030052
TSG Approval meeting:
-
PCG Approval meeting:
-
TSG Stopped meeting:
TP-22
PCG Stopped meeting:
-
See Specifications specifically resulting from this Work Item
See all related Change Requests related to this Work Item (all specifications)
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