WI # 660080 - HSUPA_DB_MC
Name: HSPA Dual-Band UL carrier aggregation
Acronym: HSUPA_DB_MC
Effective Acronym: HSUPA_DB_MC
WI Level: Building Block (2nd level)
Type: Work Item
Status: PCG approved
Release: Rel-13
Start date: -
End date: -
Remarks (0)
Creation dateAuthorRemark
No Remarks Added
Parent Work Item: 621000 - Rel-13 LTE Carrier Aggregation
Child Work Items:
WI UIDWI name
Core part: HSPA Dual-Band UL carrier aggregation
Perf. part: HSPA Dual-Band UL carrier aggregation
Responsible group(s): R4
Rapporteur(s): Qualcomm
Latest WID version: RP-142237
TSG Approval meeting: 66
PCG Approval meeting: 34
TSG Stopped meeting: -
PCG Stopped meeting: -
See Specifications specifically resulting from this Work Item
See all related Change Requests related to this Work Item (all specifications)