WI # 660080 - HSUPA_DB_MC
General
Related
Name:
HSPA Dual-Band UL carrier aggregation
Acronym:
HSUPA_DB_MC
Effective Acronym:
HSUPA_DB_MC
WI Level:
Building Block (2nd level)
Type:
Work Item
Status:
PCG approved
Release:
Rel-13
Start date:
2014-12-15
End date:
2016-03-15
Remarks (0)
Creation date
Author
Remark
No Remarks Added
Parent Work Item:
621000
- Rel-13 LTE Carrier Aggregation
Child Work Items:
WI UID
WI name
660180
Core part: HSPA Dual-Band UL carrier aggregation
660280
Perf. part: HSPA Dual-Band UL carrier aggregation
Responsible group(s):
R4
Rapporteur(s):
Qualcomm
Latest WID version:
RP-142237
TSG Approval meeting:
66
PCG Approval meeting:
34
TSG Stopped meeting:
-
PCG Stopped meeting:
-
See Specifications specifically resulting from this Work Item
See all related Change Requests related to this Work Item (all specifications)
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