WI # 660180 - HSUPA_DB_MC-Core
General
Related
Name:
Core part: HSPA Dual-Band UL carrier aggregation
Acronym:
HSUPA_DB_MC-Core
Effective Acronym:
HSUPA_DB_MC-Core
WI Level:
Work Task (3rd Level)
Type:
Work Item
Status:
PCG approved
Release:
Rel-13
Start date:
2014-12-15
End date:
2015-12-15
Remarks (5)
Creation date
Author
Remark
2020-04-24 14:04 UTC
1st Apr 15: Compl:0%->10% 1st Apr 15: WID: RP-142237->RP-150129 1st Apr 15: Stat Rep: ->RP-150127 ¦
2018-12-05 10:10 UTC
1st Apr 15: Compl:0%->10% 1st Apr 15: WID: RP-142237->RP-150129 1st Apr 15: Stat Rep: ->RP-150127 ;
2015-09-29 09:49 UTC
29/09/15: Compl:40%->50% 29/09/15: Stat Rep: RP-150761->RP-151281
2015-07-03 15:17 UTC
03/07/15: Compl:10%->40% 03/07/15: Stat Rep: RP-150127->RP-150761
2015-04-01 16:07 UTC
1st Apr 15: Compl:0%->10% 1st Apr 15: WID: RP-142237->RP-150129 1st Apr 15: Stat Rep: ->RP-150127
Parent Work Item:
660080
- HSPA Dual-Band UL carrier aggregation
Child Work Items:
WI UID
WI name
No records to display.
Responsible group(s):
R4
Rapporteur(s):
Qualcomm
Latest WID version:
RP-151852
TSG Approval meeting:
66
PCG Approval meeting:
34
TSG Stopped meeting:
-
PCG Stopped meeting:
-
See Specifications specifically resulting from this Work Item
See all related Change Requests related to this Work Item (all specifications)
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