WI # 660180 - HSUPA_DB_MC-Core
Name: Core part: HSPA Dual-Band UL carrier aggregation
Acronym: HSUPA_DB_MC-Core
Effective Acronym: HSUPA_DB_MC-Core
WI Level: Work Task (3rd Level)
Type: Work Item
Status: PCG approved
Release: Rel-13
Start date: 2014-12-15
End date: 2015-12-15
Remarks (5)
Creation dateAuthorRemark
2020-04-24 14:04 UTC
1st Apr 15: Compl:0%->10% 1st Apr 15: WID: RP-142237->RP-150129 1st Apr 15: Stat Rep: ->RP-150127 ¦
2018-12-05 10:10 UTC
1st Apr 15: Compl:0%->10% 1st Apr 15: WID: RP-142237->RP-150129 1st Apr 15: Stat Rep: ->RP-150127 ;
2015-09-29 09:49 UTC
29/09/15: Compl:40%->50% 29/09/15: Stat Rep: RP-150761->RP-151281
2015-07-03 15:17 UTC
03/07/15: Compl:10%->40% 03/07/15: Stat Rep: RP-150127->RP-150761
2015-04-01 16:07 UTC
1st Apr 15: Compl:0%->10% 1st Apr 15: WID: RP-142237->RP-150129 1st Apr 15: Stat Rep: ->RP-150127
Parent Work Item: 660080 - HSPA Dual-Band UL carrier aggregation
Child Work Items:
WI UIDWI name
No records to display.
Responsible group(s): R4
Rapporteur(s): Qualcomm
Latest WID version: RP-151852
TSG Approval meeting: 66
PCG Approval meeting: 34
TSG Stopped meeting: -
PCG Stopped meeting: -
See Specifications specifically resulting from this Work Item
See all related Change Requests related to this Work Item (all specifications)